DETAILED NOTES ON MONOCRYSTALLINE SILICON

Wire-noticed wafer slicing is among the critical manufacturing systems for industrial crystalline silicon PV cells, and improvements in wafer slicing know-how have resulted in a reduction in Uncooked wafer thickness from 370 μm to 180 μm because 1997 for Sharp industrial polycrystalline-silicon cells (Figure six). To introduce wafers thinner than